Non-cyanide electroless silver plating solution DAIN SILVER EL Process for substrates
For substrates, ease of use and reliability. Non-cyanide electroless silver plating solution Dine Silver EL-Process.
In the substrate industry, stability in signal transmission and long-term reliability are required. Particularly in connectors where high speed and high density are advancing, reducing contact resistance and improving corrosion resistance are essential for maintaining signal quality and prolonging product lifespan. The non-cyanide electroless silver plating solution, DAIN SILVER EL-Process, addresses these challenges by providing excellent coverage and a uniform plating film, supporting the manufacture of reliable connectors. 【Application Scenarios】 - Plating on products that cannot conduct electricity - Resist substrates 【Effects of Implementation】 - No immersion in resist patterns. - Silver can be displaced and deposited not only on copper but also on electroless nickel. - Usable for up to 3 turns as a guideline for bath life.
- Company：Daiwa Fine Chemicals Co., Ltd.
- Price：Other
